Modular Data Acquisition Technology Helps Increase Yield in Large Scale Integrated (LSI) Circuits
by Robin Hassell, Agilent Technologies
Modular Product Operation-Geneva
Abstract
As the integrated circuit (IC) has grown from holding merely ten transistors when it was first invented in the 1950s to the millions it can hold today, the level of chip complexity as well as the density of circuit components have grown comparatively. Automatic testing equipment (ATE) has done an excellent job of testing system components, but semiconductor manufacturing facilities are constantly aiming to increase product yield from any given wafer, maintain their test flexibility, while lowering their production testing costs.
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